5961-01-033-2330

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Model or part number: D20-28B

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About this product
Junction pattern arrangement: npn

Description

Unijunction Transistor NSN 5961-01-033-2330.

pdf NSN 5961-01-033-2330 Datasheet

MRC:
The element,compound,or mixture of which the inclosure is fabricated,excluding any surface treatment.ABBH
Inclosure Material:
Ceramic
MRC:
The dimension measured along the longitudinal axis with terminated points at the extreme ends of the item.ABHP
Overall Length:
0.280 inches
MRC:
An overall measurement taken at right angles to the length of an item,in distinction from thickness.ABMK
Overall Width:
0.300 inches
MRC:
The number of mounting facilities provided.AKPV
Mounting Facility Quantity:
1
MRC:
An indication of the internal basic form of the item.ALAS
Internal Configuration:
Junction contact
MRC:
The electrode which is internally-electrically connected to the case of the item.ALBA
Electrode Internally-electrically Connected To Case:
Collector
MRC:
The means of attaching the item.AXGY
Mounting Method:
Threaded stud
MRC:
A designation that is used for the purpose of general identification of the thread.CQJX
Thread Size:
0.164 inches
MRC:
The chemical compound or mechanical mixture properties of which the semiconductor is fabricated.CTMZ
Semiconductor Material:
Silicon
MRC:
The value of the voltage that may be applied,expressed in volts,and the symbol used to identify the specific electrical characteristic.CTQN
Voltage Rating In Volts Per Characteristic:
50.0 breakdown voltage, collector-to-emitter, with base short-circuited to emitter
MRC:
The level of electrical flow and the symbol used to identify the specific electrical characteristic.CTQX
Current Rating Per Characteristic:
2.00 amperes source cutoff current
MRC:
The amount of electrical power that can be dissipated and the specific electrical characteristic.CTRD
Power Rating Per Characteristic:
40.0 watts small-signal input power, common-collector preset
MRC:
The maximum temperature at which the item is designed to operate at each measurement point.CTSG
Maximum Operating Tempurature Per Measurement Point:
200.0 degrees celsius junction
MRC:
A designation distinguishing one group of thread diameter-pitch combinations from another by the number of threads per measurement scale for a specific diameter.THSD
Thread Series Designator:
Unc
MRC:
Indicates the type and number of terminals for providing electrical connection.TTQY
Terminal Type And Quantity:
4 ferrule
MRC:
--
NIIN:
010332330
MRC:
--
NATO Stock Number:
5961-01-033-2330
MRC:
--
Shelf Life:
N/A
MRC:
--
UOM:
--
MRC:
--
DEMIL:
Yes - DEMIL/MLI
Export Control Information  
FIIG:
--
FIIG:
A110A0
MRC:
--
INC:
20588
MRC:
--
IMM:
TX
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All Products Certified

Factory New, New Material, New Surplus, Overhauled, Serviceable, Repairable, and AS Removed / Used material will be accompanied by a Certificate of Conformance, and any other documents/trace when applicable. We have a 7 year record retention.

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Quality | ISO 9001:2015 + AS9120B

We are committed to quality and follow an AS9120 quality management system. AeroBase Group is HAZMAT certified and registered with DDTC, ITAR, and Aviation Suppliers Association (ASA). All products are 100% inspected.

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Shipping

Delivery of IN-STOCK orders ship same-day when order is placed before 2:00 PM EST.

Delivery dates for NON-STOCK items are estimates based on current backlog and are subject to confirmation at the time of order.

Formal Definition

Government issue definition of NSN 5961-01-033-2330

An active semiconductor device with three or more electrodes. May or may not include mounting hardware and/or heatsink. Excludes semiconductor device, diode and semiconductor device, thyristor. For solid state devices which are responsive to visible or infrared radiant energy, see semiconductor device, photo.

Packaging & Dimensions

MIL-STD codes: http://www.dla.mil/LandandMaritime/.../MILSTD2073Codes.aspx
Est. Pack Size
Est. Pack Weight
Est. Item Weight
Est. Item Dim.
Pack Size:
--
Paclk Weight:
--
Item Weight:
--
Item Dim:
--
Container
OPI
SPI No.
SPI Rev.
SPC Mkg.
LVL A
LVL B
LVL C
Container:
--
OPI:
O
SPI No.:
SPI Rev.:
SPC Mkg:
00
LVL_A:
Q
LVL_B:
Q
LVL_C:
CUSH
MOP
CATEG.
PRES MAT
WRAP MAT
ICQ
THK
TOS
UCL
CUSH DUN:
XX
MOP:
ZZ
PKG:
69F0
PRES MAT:
XX
WRAP MAT:
XX
ICQ:
XXX
THK:
X
TOS:
UCL:

Packaging Codes Definitions:

LVL A Code (LVL_A) Q

Packing shall be accomplished in accordance with table c.Ii for the packing level specified. closure, sealing and reinforcement shall be in accordance with applicable specification for shipping container.

LVL B Code (LVL_B) Q

Packing shall be accomplished in accordance with table c.Ii for the packing level specified. closure, sealing and reinforcement shall be in accordance with the appropriate shipping container specification.

Procedure Indicator Code (OPI) O

Options can be exercised as to specific method of preservation or dod approved packaging materials to be used. however, basic preservation method shall be retained, supplemental data shall be complied with, and unit package dimensions shall not be increased by more than one inch. equal or better protection shall be given the item and there shall be no increase in the package cost.

Special Markings Code (SPC_MKG) 00

No special marking.

Method of Preservation (MOP) ZZ

See j.4.1.B.

Import / Export

Schedule B Classification
Schedule B Number
NAIC National Association of Insurance Commissioners
End Use A classification system for U.S. exported and imported merchandise based on principal use rather than the physical characteristics of the merchandise. End-Use codes are assigned by the Bureau of Economic Analysis under the U.S. Department of Commerce.
SITC Commodity classification system defined by the United Nations.
USDA
HITECH
Schedule B:
8541500080
NAICS:
334413
End Use Class:
21320
SITC:
77639
USDA:
1
HITECH:
5

Schedule B Codes Definitions:

Schedule B 8541500080

Semiconductor Devices, Nesoi

End Use Code 21320

Semiconductors

Standard Intl. Trade Class (SITC) 77639

Semiconductor Devices, N.e.s.

Manufacturers

This NSN is registered to the following cage codes.
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