5961-01-185-1072

Semiconductor Device Assembly email this page
ITAR Registered

Model or part number: 675-22407-1

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Description

Subminiature Lamp Array NSN 5961-01-185-1072.

pdf NSN 5961-01-185-1072 Datasheet

MRC:
The principal parts that are included in an assembled unit.AEAS
Major Components:
Printed wiring bd 1; diodes 60
MRC:
The national stock number or the identification information of the end equipment for which the item is a part.AGAV
End Application:
An/alq-17 (v) 1/2 common
MRC:
--
NIIN:
011851072
MRC:
--
NATO Stock Number:
5961-01-185-1072
MRC:
--
Shelf Life:
N/A
MRC:
--
UOM:
--
MRC:
--
DEMIL:
FIIG:
--
FIIG:
T01200
MRC:
--
INC:
35565
MRC:
--
IMM:
TX TX TX
Certified products icon

All Products Certified

Factory New, New Material, New Surplus, Overhauled, Serviceable, Repairable, and AS Removed / Used material will be accompanied by a Certificate of Conformance, and any other documents/trace when applicable. We have a 7 year record retention.

Quality inspections icon

Quality | ISO 9001:2015 + AS9120B

We are committed to quality and follow an AS9120 quality management system. AeroBase Group is HAZMAT certified and registered with DDTC, ITAR, and Aviation Suppliers Association (ASA). All products are 100% inspected.

Quality Commitment »

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Shipping

Delivery of IN-STOCK orders ship same-day when order is placed before 2:00 PM EST.

Delivery dates for NON-STOCK items are estimates based on current backlog and are subject to confirmation at the time of order.

Formal Definition

Government issue definition of NSN 5961-01-185-1072

A grouping of two or more semiconducting devices such as light emitting diode; semiconductor device, diode; semiconductor device, photo; semiconductor device, thyristor; and/or transistor mounted on a common mounting or mounted on each other. The devices must be separable and each item must be capable of functioning in accordance with its given name. For assemblies consisting of semiconducting devices permanently cased, encapsulated, or potted together to form a single unit, see rectifier, semiconductor device, unitized and semiconductor devices, unitized. Excludes semiconductor device set; microcircuit assembly; and microcircuit set. See also absorber, overvoltage.

Packaging & Dimensions

MIL-STD codes: http://www.dla.mil/LandandMaritime/.../MILSTD2073Codes.aspx
Est. Pack Size
Est. Pack Weight
Est. Item Weight
Est. Item Dim.
Pack Size:
12.5 X 8.3 X 4.0
Paclk Weight:
1.0000lbs
Item Weight:
0.0000lbs
Item Dim:
--
Container
OPI
SPI No.
SPI Rev.
SPC Mkg.
LVL A
LVL B
LVL C
Container:
4294967295
OPI:
M
SPI No.:
F000009XC6
SPI Rev.:
SPC Mkg:
39
LVL_A:
LVL_B:
LVL_C:
CUSH
MOP
CATEG.
PRES MAT
WRAP MAT
ICQ
THK
TOS
UCL
CUSH DUN:
XX
MOP:
GX
PKG:
PRES MAT:
00
WRAP MAT:
XX
ICQ:
000
THK:
X
TOS:
UCL:
B

Packaging Codes Definitions:

Procedure Indicator Code (OPI) M

All packaging data is mandatory for compliance and no substitutions are permitted. fast packs should be included in this category.

Special Markings Code (SPC_MKG) 39

Esd sensitive electronic device requirements of mil-std-129 apply.

Method of Preservation (MOP) GX

Preserve by method 41 as follows: items subject to damage by electromagnetic and electrostatic field forces shall be initally wrapped in material conforming to mil-prf-81705, type iii, or bags conforming to mil-dtl-117, type ii, class h, style 2, or cushioned in material conforming to a-a-3129 or ppp-c-795, class 2 or ppp-c-1797, type ii, to prevent bag puncture, and unit packed in a heat-sealed bag conforming to mil-dtl-117, type i, class f, style 1. reclosable cushioned pouches conforming to mil-dtl-81997, type i or ii, may be used in lieu of initial wrap or cushioning. lead or terminal configurations for all items shall be maintained as manufactured without causing loads or stresses capable of causing damage to the item. materials used to maintain item position and lead or terminal configuration shall permit item removal without damage to the item. electrostatic discharge (esd) sensitive caution labels shall be applied in accordance with mil-std-129. connectors and plugs (power or data) shall be covered with conductive caps/plugs.

Preservation Material (PRES_MAT) 00

No requirement.

Import / Export

Schedule B Classification
Schedule B Number
NAIC National Association of Insurance Commissioners
End Use A classification system for U.S. exported and imported merchandise based on principal use rather than the physical characteristics of the merchandise. End-Use codes are assigned by the Bureau of Economic Analysis under the U.S. Department of Commerce.
SITC Commodity classification system defined by the United Nations.
USDA
HITECH
Schedule B:
8541500080
NAICS:
334413
End Use Class:
21320
SITC:
77639
USDA:
1
HITECH:
5

Schedule B Codes Definitions:

Schedule B 8541500080

Semiconductor Devices, Nesoi

End Use Code 21320

Semiconductors

Standard Intl. Trade Class (SITC) 77639

Semiconductor Devices, N.e.s.

Freight

Universal / National freight and handling information
NMFC
Class
UFC
LTL
LCL
WCC
TCC
SHC
ADC
ACC
NMFC:
063025
NMF Description:
Semiconductors/devices Noi Etc Sub1
UFC:
34525
LTL:
100.0
LCL:
--
WCC:
72D
TCC:
3
SHC:
Z
ADC:
A
ACC:
H

Freight Codes Definitions:

Cargo Type (TCC) 3

Electrostatic sensitive device (esd).

Water Commodity (WCC) 72D

Communications/electronics, other than sigint/ew or comsec repair parts and components.

Air Commodity (ACC) H

Instruments/equipment/supplies for radio, communications, electrical, laboratory, etc. (includes signal corps).

Air Dimensions (ADC) A

Shipment is not a consolidation and does not exceed 84 inches in any dimension.

Air Special Handling (SHC) Z

Other or no special handling required (sh)

Manufacturers

This NSN is registered to the following cage codes.
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