Model or part number: 587R052H01
About this product
All semiconductor device diode junction pattern arrangement: pn
Variactor Array NSN 5961-01-258-4759.
Factory New, New Material, New Surplus, Overhauled, Serviceable, Repairable, and AS Removed / Used material will be accompanied by a Certificate of Conformance, and any other documents/trace when applicable. We have a 7 year record retention.
We are committed to quality and follow an AS9120 quality management system. AeroBase Group is HAZMAT certified and registered with DDTC,
ITAR, and Aviation Suppliers Association (ASA). All products are 100% inspected.
Quality Commitment »
Delivery of IN-STOCK orders ship same-day when order is placed before 2:00 PM EST.
Delivery dates for NON-STOCK items are estimates based on current backlog and are subject to confirmation at the time of order.
Two or more discrete semiconductor devices such as diode(s) and/or transistor(s), permanently cased, encapsulated, or potted together to form an inseparable unit. Excludes devices having one or more components other than semiconductor devices. The individually distinct devices forming the unit may be internally connected. The unit in itself does not perform a complete specific function and cannot be assigned a more definite item name. It may include or consist of inseparable matched pairs. May or may not include mounting hardware and/or heatsink. For interconnected items arranged in stack(s), see rectifier, semiconductor device. For items formed on or within a semiconductor material substrate, formed on an insulating substrate or formed on a combination of both of these types, see microcircuit (as modified). Excludes network (as modified); absorber, overvoltage; semiconductor device set; and semiconductor device assembly. Do not use if more specific name applies.
Packing shall be accomplished in accordance with table c.Ii for the packing level specified. closure, sealing and reinforcement shall be in accordance with applicable specification for shipping container.
Packing shall be accomplished in accordance with table c.Ii for the packing level specified. closure, sealing and reinforcement shall be in accordance with the appropriate shipping container specification.
Packing shall be accomplished to meet the performance test requirements of astm-d4169, distribution cycle 18, assurance level 3.
All packaging data is mandatory for compliance and no substitutions are permitted. fast packs should be included in this category.
Special requirements.
See j.4.1.B.
Semiconductor Devices, Nesoi
Semiconductors
Semiconductor Devices, N.e.s.
Electrostatic sensitive device (esd).
Communications/electronics, other than sigint/ew or comsec repair parts and components.
Instruments/equipment/supplies for radio, communications, electrical, laboratory, etc. (includes signal corps).
Shipment is not a consolidation and does not exceed 84 inches in any dimension.
Other or no special handling required (sh)
11/17 |
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Code | Definition |
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FN | Factory New. Parts manufactured by the OEM and includes manufacturer certification. |
NE | New. Parts manufactured by the OEM. May include manufacturer certification or company certification. |
NS | New Surplus. New material item purchased from excess inventory. |
OH | Overhauled. Product has been rebuilt and tested in accordance with the manufacturer's specifications by a repair shop (MRO). |
SV | Serviceable product. |
AR | As Removed. Product removed from aircraft or platform with no guarentee on the functionality of the part. |
RP | Repairable. Product can be repaired by a MRO and be given a FAA 8130 or EASA Form 1 certification. |
Part Number | RNVC | RNAAC | DAC | CAGE |
---|---|---|---|---|
587R052H01 | 2 | TX | A | 97942 |
SA9741 | 2 | ZZ | 5 | SH879 |
SA9741 | 9 | TX | 6 | 14099 |
587R052H01 | 2 | TX | A | 97942 |
SA9741 | 2 | ZZ | 5 | SH879 |
SA9741 | 9 | TX | 6 | 14099 |
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