Model or part number: 60224-400
Subminiature Lamp Array NSN 5961-01-311-0660.
Factory New, New Material, New Surplus, Overhauled, Serviceable, Repairable, and AS Removed / Used material will be accompanied by a Certificate of Conformance, and any other documents/trace when applicable. We have a 7 year record retention.
We are committed to quality and follow an AS9120 quality management system. AeroBase Group is HAZMAT certified and registered with DDTC,
ITAR, and Aviation Suppliers Association (ASA). All products are 100% inspected.
Quality Commitment »
Delivery of IN-STOCK orders ship same-day when order is placed before 2:00 PM EST.
Delivery dates for NON-STOCK items are estimates based on current backlog and are subject to confirmation at the time of order.
A grouping of two or more semiconducting devices such as light emitting diode; semiconductor device, diode; semiconductor device, photo; semiconductor device, thyristor; and/or transistor mounted on a common mounting or mounted on each other. The devices must be separable and each item must be capable of functioning in accordance with its given name. For assemblies consisting of semiconducting devices permanently cased, encapsulated, or potted together to form a single unit, see rectifier, semiconductor device, unitized and semiconductor devices, unitized. Excludes semiconductor device set; microcircuit assembly; and microcircuit set. See also absorber, overvoltage.
Packing shall be accomplished in accordance with table c.Ii for the packing level specified. closure, sealing and reinforcement shall be in accordance with applicable specification for shipping container.
Packing shall be accomplished in accordance with table c.Ii for the packing level specified. closure, sealing and reinforcement shall be in accordance with the appropriate shipping container specification.
Options can be exercised as to specific method of preservation or dod approved packaging materials to be used. however, basic preservation method shall be retained, supplemental data shall be complied with, and unit package dimensions shall not be increased by more than one inch. equal or better protection shall be given the item and there shall be no increase in the package cost.
No special marking.
See j.4.1.B.
Semiconductor Devices, Nesoi
Semiconductors
Semiconductor Devices, N.e.s.
Code | Definition |
---|---|
FN | Factory New. Parts manufactured by the OEM and includes manufacturer certification. |
NE | New. Parts manufactured by the OEM. May include manufacturer certification or company certification. |
NS | New Surplus. New material item purchased from excess inventory. |
OH | Overhauled. Product has been rebuilt and tested in accordance with the manufacturer's specifications by a repair shop (MRO). |
SV | Serviceable product. |
AR | As Removed. Product removed from aircraft or platform with no guarentee on the functionality of the part. |
RP | Repairable. Product can be repaired by a MRO and be given a FAA 8130 or EASA Form 1 certification. |
Part Number | RNVC | RNAAC | DAC | CAGE |
---|---|---|---|---|
60224-400 | 2 | TX | 5 | 16236 |
60224-400 | 2 | TX | A | K0656 |
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