5961-01-312-4663

Unitized Semiconductor Devices email this page

Model or part number: SKKT 56/12E

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About this product
All semiconductor deivce thyristor junction pattern arrangement: pnpn

Description

Variactor Array NSN 5961-01-312-4663.

pdf NSN 5961-01-312-4663 Datasheet

MRC:
The element,compound,or mixture of which the inclosure is fabricated,excluding any surface treatment.ABBH
Inclosure Material:
Ceramic
MRC:
The dimension measured along the longitudinal axis with terminated points at the extreme ends of the item.ABHP
Overall Length:
92.0 millimeters
MRC:
The distance measured in a straight line from the bottom to the top of an item.ABKW
Overall Height:
20.0 millimeters
MRC:
An overall measurement taken at right angles to the length of an item,in distinction from thickness.ABMK
Overall Width:
30.0 millimeters
MRC:
The alpha-numeric symbol assigned by the electronic industries association,to registered physical configurations of the cases for electronic items.ALAZ
Joint Electronic Device Engineering Council/jedec/case Outline Designation:
To-240aa
MRC:
The name and number of components included.ASKA
Component Name And Quantity:
2 semiconductor device thyristor
MRC:
The means of attaching the item.AXGY
Mounting Method:
Press fit
MRC:
Those features,not otherwise specified,which may be required for proper functioning of the item.CBBL
Features Provided:
Hermetically sealed case
MRC:
The chemical compound or mechanical mixture properties of which the semiconductor is fabricated.CTMZ
Semiconductor Material:
Silicon all semiconductor device thyristor
MRC:
The value of the voltage that may be applied,expressed in volts,and the symbol used to identify the specific electrical characteristic.CTQN
Voltage Rating In Volts Per Characteristic:
1300.0 nonrepetitive peak reverse voltage all semiconductor device thyristor and 1200.0 repetitive peak off-state voltage all semiconductor device thyristor and 1200.0 repetitive peak reverse voltage all semiconductor device thyristor
MRC:
The level of electrical flow and the symbol used to identify the specific electrical characteristic.CTQX
Current Rating Per Characteristic:
60.00 amperes forward current, total rms universal all semiconductor device thyristor
MRC:
The maximum temperature at which the item is designed to operate at each measurement point.CTSG
Maximum Operating Tempurature Per Measurement Point:
125.0 degrees celsius junction
MRC:
Indicates the type and number of terminals for providing electrical connection.TTQY
Terminal Type And Quantity:
5 uninsulated wire lead
MRC:
--
NIIN:
013124663
MRC:
--
NATO Stock Number:
5961-01-312-4663
MRC:
--
Shelf Life:
N/A
MRC:
--
UOM:
--
MRC:
--
DEMIL:
No
FIIG:
--
FIIG:
A110A0
MRC:
--
INC:
61962
MRC:
--
IMM:
TX
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All Products Certified

Factory New, New Material, New Surplus, Overhauled, Serviceable, Repairable, and AS Removed / Used material will be accompanied by a Certificate of Conformance, and any other documents/trace when applicable. We have a 7 year record retention.

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Quality | ISO 9001:2015 + AS9120B

We are committed to quality and follow an AS9120 quality management system. AeroBase Group is HAZMAT certified and registered with DDTC, ITAR, and Aviation Suppliers Association (ASA). All products are 100% inspected.

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Shipping

Delivery of IN-STOCK orders ship same-day when order is placed before 2:00 PM EST.

Delivery dates for NON-STOCK items are estimates based on current backlog and are subject to confirmation at the time of order.

Formal Definition

Government issue definition of NSN 5961-01-312-4663

Two or more discrete semiconductor devices such as diode(s) and/or transistor(s), permanently cased, encapsulated, or potted together to form an inseparable unit. Excludes devices having one or more components other than semiconductor devices. The individually distinct devices forming the unit may be internally connected. The unit in itself does not perform a complete specific function and cannot be assigned a more definite item name. It may include or consist of inseparable matched pairs. May or may not include mounting hardware and/or heatsink. For interconnected items arranged in stack(s), see rectifier, semiconductor device. For items formed on or within a semiconductor material substrate, formed on an insulating substrate or formed on a combination of both of these types, see microcircuit (as modified). Excludes network (as modified); absorber, overvoltage; semiconductor device set; and semiconductor device assembly. Do not use if more specific name applies.

Packaging & Dimensions

MIL-STD codes: http://www.dla.mil/LandandMaritime/.../MILSTD2073Codes.aspx
Est. Pack Size
Est. Pack Weight
Est. Item Weight
Est. Item Dim.
Pack Size:
--
Paclk Weight:
0.9000lbs
Item Weight:
--
Item Dim:
--
Container
OPI
SPI No.
SPI Rev.
SPC Mkg.
LVL A
LVL B
LVL C
Container:
--
OPI:
O
SPI No.:
SPI Rev.:
SPC Mkg:
ZZ
LVL_A:
Q
LVL_B:
Q
LVL_C:
6
CUSH
MOP
CATEG.
PRES MAT
WRAP MAT
ICQ
THK
TOS
UCL
CUSH DUN:
XX
MOP:
ZZ
PKG:
69FZ
PRES MAT:
XX
WRAP MAT:
XX
ICQ:
XXX
THK:
X
TOS:
UCL:

Packaging Codes Definitions:

LVL A Code (LVL_A) Q

Packing shall be accomplished in accordance with table c.Ii for the packing level specified. closure, sealing and reinforcement shall be in accordance with applicable specification for shipping container.

LVL B Code (LVL_B) Q

Packing shall be accomplished in accordance with table c.Ii for the packing level specified. closure, sealing and reinforcement shall be in accordance with the appropriate shipping container specification.

LVL C Code (LVL_C) 6

Packing shall be accomplished to meet the performance test requirements of astm-d4169, distribution cycle 18, assurance level 3.

Procedure Indicator Code (OPI) O

Options can be exercised as to specific method of preservation or dod approved packaging materials to be used. however, basic preservation method shall be retained, supplemental data shall be complied with, and unit package dimensions shall not be increased by more than one inch. equal or better protection shall be given the item and there shall be no increase in the package cost.

Special Markings Code (SPC_MKG) ZZ

Special requirements.

Method of Preservation (MOP) ZZ

See j.4.1.B.

Import / Export

Schedule B Classification
Schedule B Number
NAIC National Association of Insurance Commissioners
End Use A classification system for U.S. exported and imported merchandise based on principal use rather than the physical characteristics of the merchandise. End-Use codes are assigned by the Bureau of Economic Analysis under the U.S. Department of Commerce.
SITC Commodity classification system defined by the United Nations.
USDA
HITECH
Schedule B:
8541500080
NAICS:
334413
End Use Class:
21320
SITC:
77639
USDA:
1
HITECH:
5

Schedule B Codes Definitions:

Schedule B 8541500080

Semiconductor Devices, Nesoi

End Use Code 21320

Semiconductors

Standard Intl. Trade Class (SITC) 77639

Semiconductor Devices, N.e.s.

Freight

Universal / National freight and handling information
NMFC
Class
UFC
LTL
LCL
WCC
TCC
SHC
ADC
ACC
NMFC:
063025
NMF Description:
Semiconductors/devices Noi Etc
UFC:
34525
LTL:
Rating variable
LCL:
--
WCC:
72D
TCC:
3
SHC:
9
ADC:
A
ACC:
H

Freight Codes Definitions:

Cargo Type (TCC) 3

Electrostatic sensitive device (esd).

Water Commodity (WCC) 72D

Communications/electronics, other than sigint/ew or comsec repair parts and components.

Air Commodity (ACC) H

Instruments/equipment/supplies for radio, communications, electrical, laboratory, etc. (includes signal corps).

Air Dimensions (ADC) A

Shipment is not a consolidation and does not exceed 84 inches in any dimension.

Air Special Handling (SHC) 9

Other or no special handling required (sh)

Manufacturers

This NSN is registered to the following cage codes.
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