5961-01-384-9067

Semiconductor Device Assembly email this page

Model or part number: 253204-1

Pricing & Availability

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Description

Subminiature Lamp Array NSN 5961-01-384-9067.

pdf NSN 5961-01-384-9067 Datasheet

MRC:
The principal parts that are included in an assembled unit.AEAS
Major Components:
Transistors 2
MRC:
The national stock number or the identification information of the end equipment for which the item is a part.AGAV
End Application:
Arm decoy
MRC:
--
NIIN:
013849067
MRC:
--
NATO Stock Number:
5961-01-384-9067
MRC:
--
Shelf Life:
N/A
MRC:
--
UOM:
--
MRC:
--
DEMIL:
No
FIIG:
--
FIIG:
T01200
MRC:
--
INC:
35565
MRC:
--
IMM:
TX TX TX
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All Products Certified

Factory New, New Material, New Surplus, Overhauled, Serviceable, Repairable, and AS Removed / Used material will be accompanied by a Certificate of Conformance, and any other documents/trace when applicable. We have a 7 year record retention.

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Quality | ISO 9001:2015 + AS9120B

We are committed to quality and follow an AS9120 quality management system. AeroBase Group is HAZMAT certified and registered with DDTC, ITAR, and Aviation Suppliers Association (ASA). All products are 100% inspected.

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Shipping

Delivery of IN-STOCK orders ship same-day when order is placed before 2:00 PM EST.

Delivery dates for NON-STOCK items are estimates based on current backlog and are subject to confirmation at the time of order.

Formal Definition

Government issue definition of NSN 5961-01-384-9067

A grouping of two or more semiconducting devices such as light emitting diode; semiconductor device, diode; semiconductor device, photo; semiconductor device, thyristor; and/or transistor mounted on a common mounting or mounted on each other. The devices must be separable and each item must be capable of functioning in accordance with its given name. For assemblies consisting of semiconducting devices permanently cased, encapsulated, or potted together to form a single unit, see rectifier, semiconductor device, unitized and semiconductor devices, unitized. Excludes semiconductor device set; microcircuit assembly; and microcircuit set. See also absorber, overvoltage.

Packaging & Dimensions

MIL-STD codes: http://www.dla.mil/LandandMaritime/.../MILSTD2073Codes.aspx
Est. Pack Size
Est. Pack Weight
Est. Item Weight
Est. Item Dim.
Pack Size:
9.3 X 6.3 X 3.0
Paclk Weight:
1.2000lbs
Item Weight:
0.3000lbs
Item Dim:
005000450010
Container
OPI
SPI No.
SPI Rev.
SPC Mkg.
LVL A
LVL B
LVL C
Container:
4294967295
OPI:
M
SPI No.:
F000003XC3
SPI Rev.:
SPC Mkg:
17
LVL_A:
0
LVL_B:
F
LVL_C:
0
CUSH
MOP
CATEG.
PRES MAT
WRAP MAT
ICQ
THK
TOS
UCL
CUSH DUN:
XX
MOP:
41
PKG:
69A0
PRES MAT:
00
WRAP MAT:
XX
ICQ:
000
THK:
X
TOS:
UCL:
B

Packaging Codes Definitions:

LVL B Code (LVL_B) F

Packing is not required. the unit container shall also serve as the shipping container. closure, sealing and reinforcement shall be in accordance with applicable specification for shipping container.

Procedure Indicator Code (OPI) M

All packaging data is mandatory for compliance and no substitutions are permitted. fast packs should be included in this category.

Special Markings Code (SPC_MKG) 17

Reusable container.

Method of Preservation (MOP) 41

Watervaporproof bag, sealed.

Preservation Material (PRES_MAT) 00

No requirement.

Import / Export

Schedule B Classification
Schedule B Number
NAIC National Association of Insurance Commissioners
End Use A classification system for U.S. exported and imported merchandise based on principal use rather than the physical characteristics of the merchandise. End-Use codes are assigned by the Bureau of Economic Analysis under the U.S. Department of Commerce.
SITC Commodity classification system defined by the United Nations.
USDA
HITECH
Schedule B:
8541500080
NAICS:
334413
End Use Class:
21320
SITC:
77639
USDA:
1
HITECH:
5

Schedule B Codes Definitions:

Schedule B 8541500080

Semiconductor Devices, Nesoi

End Use Code 21320

Semiconductors

Standard Intl. Trade Class (SITC) 77639

Semiconductor Devices, N.e.s.

Manufacturers

This NSN is registered to the following cage codes.
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