6030-01-414-8582

Semiconductor Device Assembly email this page
ITAR Registered

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Picture of NSN 6030-01-414-8582 Picture of NSN 6030-01-414-8582 Picture of NSN 6030-01-414-8582 Picture of NSN 6030-01-414-8582

Model or part number: PX-D603

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Description

Subminiature Lamp Array NSN 6030-01-414-8582.

pdf NSN 6030-01-414-8582 Datasheet

MRC:
The national stock number or the identification information of the end equipment for which the item is a part.AGAV
End Application:
Gpete program
MRC:
--
NIIN:
014148582
MRC:
--
NATO Stock Number:
6030-01-414-8582
MRC:
--
Shelf Life:
N/A
MRC:
--
UOM:
--
MRC:
--
DEMIL:
Yes - DEMIL/MLI
Export Control Information  
FIIG:
--
FIIG:
T01200
MRC:
--
INC:
35565
MRC:
--
IMM:
TX TX TX
Certified products icon

All Products Certified

Factory New, New Material, New Surplus, Overhauled, Serviceable, Repairable, and AS Removed / Used material will be accompanied by a Certificate of Conformance, and any other documents/trace when applicable. We have a 7 year record retention.

Quality inspections icon

Quality | ISO 9001:2015 + AS9120B

We are committed to quality and follow an AS9120 quality management system. AeroBase Group is HAZMAT certified and registered with DDTC, ITAR, and Aviation Suppliers Association (ASA). All products are 100% inspected.

Quality Commitment »

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Shipping

Delivery of IN-STOCK orders ship same-day when order is placed before 2:00 PM EST.

Delivery dates for NON-STOCK items are estimates based on current backlog and are subject to confirmation at the time of order.

End Items and Platforms

End items to which this NSN is a component of.

Parts and Components for Semiconductor Device Assembly NSN 6030-01-414-8582 Parts and components for this end application.

NSN Component Description
NSN 5961-01-461-3063 Diode Semiconductor Device
NSN 5961-01-461-3066 Diode Semiconductor Device
NSN 5961-01-461-3070 Diode Semiconductor Device
NSN 5961-01-461-3254 Diode Semiconductor Device
NSN 5962-01-461-3546 Digital Microcircuit
NSN 5961-01-461-3755 Diode Semiconductor Device
NSN 5962-01-461-4091 Linear Microcircuit
NSN 5961-01-461-4093 Diode Semiconductor Device
NSN 5962-01-461-4094 Digital Microcircuit
NSN 5961-01-461-4096 Diode Semiconductor Device
NSN 5961-01-461-4097 Diode Semiconductor Device
NSN 5935-01-461-4822 Ele Modular Receptacle Connector
NSN 5935-01-461-5048 Tip Jack Assembly
NSN 5935-01-461-5894 Electrical Receptacle Connector
NSN 5962-01-461-6297 Digital Microcircuit
NSN 5962-01-461-6302 Digital Microcircuit
NSN 5905-01-463-5675 Nonwire Wound Variable Resistor

Formal Definition

Government issue definition of NSN 6030-01-414-8582

A grouping of two or more semiconducting devices such as light emitting diode; semiconductor device, diode; semiconductor device, photo; semiconductor device, thyristor; and/or transistor mounted on a common mounting or mounted on each other. The devices must be separable and each item must be capable of functioning in accordance with its given name. For assemblies consisting of semiconducting devices permanently cased, encapsulated, or potted together to form a single unit, see rectifier, semiconductor device, unitized and semiconductor devices, unitized. Excludes semiconductor device set; microcircuit assembly; and microcircuit set. See also absorber, overvoltage.

Packaging & Dimensions

MIL-STD codes: http://www.dla.mil/LandandMaritime/.../MILSTD2073Codes.aspx
Est. Pack Size
Est. Pack Weight
Est. Item Weight
Est. Item Dim.
Pack Size:
--
Paclk Weight:
--
Item Weight:
--
Item Dim:
--
Container
OPI
SPI No.
SPI Rev.
SPC Mkg.
LVL A
LVL B
LVL C
Container:
--
OPI:
A
SPI No.:
SPI Rev.:
SPC Mkg:
99
LVL_A:
E
LVL_B:
Q
LVL_C:
Q
CUSH
MOP
CATEG.
PRES MAT
WRAP MAT
ICQ
THK
TOS
UCL
CUSH DUN:
ZZ
MOP:
ZZ
PKG:
ZZZ0
PRES MAT:
00
WRAP MAT:
ZZ
ICQ:
000
THK:
Z
TOS:
A
UCL:
O

Packaging Codes Definitions:

LVL A Code (LVL_A) E

Packing shall be accomplished to meet the performance test requirements of astm-d4169, distribution cycle 18, assurance level 1.

LVL B Code (LVL_B) Q

Packing shall be accomplished in accordance with table c.Ii for the packing level specified. closure, sealing and reinforcement shall be in accordance with the appropriate shipping container specification.

Procedure Indicator Code (OPI) A

Packaging is in accordance with a procedural specification or a special packaging instruction (spi). the appropriate specification number will be shown in the clear in the supplemental data area.

Type of Storage (TOS) A

Heated general purpose - heated 40 f and above.

Method of Preservation (MOP) ZZ

See j.4.1.B.

Cushion Material (CUSH) ZZ

Special requirements. see specific instructions or drawings provided.

Preservation Material (PRES_MAT) 00

No requirement.

Freight

Universal / National freight and handling information
NMFC
Class
UFC
LTL
LCL
WCC
TCC
SHC
ADC
ACC
NMFC:
063025
NMF Description:
Semiconductors/devices Noi Etc
UFC:
34525
LTL:
Rating variable
LCL:
Rating variable
WCC:
658
TCC:
Z
SHC:
9
ADC:
A
ACC:
H

Freight Codes Definitions:

Cargo Type (TCC) Z

No special type of cargo code applicable.

Water Commodity (WCC) 658

Electrical appliances, small.

Air Commodity (ACC) H

Instruments/equipment/supplies for radio, communications, electrical, laboratory, etc. (includes signal corps).

Air Dimensions (ADC) A

Shipment is not a consolidation and does not exceed 84 inches in any dimension.

Air Special Handling (SHC) 9

Other or no special handling required (sh)

Manufacturers

This NSN is registered to the following cage codes.
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